IP Library › Assignment 043983/0375
Patent Assignment
Reel/Frame 043983/0375

Assignment of Assignor's Interest

Recorded: 2017-10-30 Pages: 9
Assignors
JHA, ASHISH KUMAR
Executed: 2017-10-27
YU, HONG
Executed: 2017-10-26
DOU, XINYUAN
Executed: 2017-10-26
WU, XUSHENG
Executed: 2017-10-26
CHOI, DONGIL
Executed: 2017-10-24
BANGHART, EDMUND K.
Executed: 2017-10-27
HASSAN, MD KHALED
Executed: 2017-10-27
Assignee
GLOBALFOUNDRIES INC.
PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Selective Shallow Trench Isolation (Sti) Fill for Stress Engineering in Semiconductor Structures
Application: 15/797,380 →
Publication: US 2019/0131452
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →