Patent Assignment
Reel/Frame 044204/0508
Assignment of Assignor's Interest
Recorded: 2017-10-12
Pages: 14
Assignors
PAEK, JONG SIK
Executed: 2014-07-24
KIM, JIN YOUNG
Executed: 2014-07-24
KIM, JIN HAN
Executed: 2014-07-30
CHA, SE WOONG
Executed: 2014-07-24
BAE, JAE HUN
Executed: 2014-07-30
KIM, DONG JIN
Executed: 2014-07-28
PARK, DOO HYUN
Executed: 2014-07-24
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Apr 11, 2023
From: KIM, YOONJOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063288/0670 →
Assignment of Assignor's Interest
Apr 12, 2023
From: LEE, SEUNGJAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063299/0856 →