Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
View Patent ↗A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.
1. A semiconductor device, the device comprising:
a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces;
an encapsulant encapsulating the side surfaces of the semiconductor die;
a contact pad on the first surface of the semiconductor die; and
a redistribution layer coupled to the contact pad wherein:
the redistribution layer comprises a linear portion and a circular pad; and
a hemispherical conductive bump on the circular pad comprises a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump.
2. The device according to claim 1 , wherein the second surface of the semiconductor die is coplanar with a surface of the encapsulant.
3. The device according to claim 1 , wherein an insulating film covers a portion of the first surface of the semiconductor die and a first surface of the encapsulant.
4. The device according to claim 3 , wherein a through via extends from the redistribution layer through the insulating film and the encapsulant.
5. The device according to claim 4 , wherein the through via is at least partially filled with conductive material.
6. A semiconductor device, the device comprising:
a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces;
a non-photosensitive protection layer covering a portion of the first surface of the semiconductor die;
a contact pad on the first surface of the semiconductor die;
a redistribution layer on the non-photosensitive protection layer and the contact pad, the redistribution layer comprising a linear portion and a circular contact pad; and
a hemispherical conductive bump on a circular pad comprising a protruding part extending toward the linear portion, wherein the protruding part has a radius less than the hemispherical conductive bump.
7. The device according to claim 6 , wherein a through via extends from the redistribution layer through the non-photosensitive protection layer.
8. The device according to claim 7 , wherein the through via is at least partially filled with conductive material.
9. The device according to claim 6 , wherein the hemispherical conductive bump comprises a solder bump.
10. The device according to claim 9 , wherein the solder bump comprises a eutectic solder.
11. The device according to claim 9 , wherein the solder bump comprises a lead-free solder.
12. The device according to claim 6 , wherein the circular pad is on the non-photosensitive protection layer.
13. The device according to claim 6 , wherein an encapsulant encapsulates the redistribution layer, the non-photosensitive protection layer, and a portion of the hemispherical conductive bump.
14. A semiconductor device, the device comprising:
a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces;
an insulating film covering a portion of the first surface of the semiconductor die; and
a redistribution layer on the insulating film and electrically coupled to the semiconductor die, wherein:
the redistribution layer comprises a linear portion; and
a circular pad and a hemispherical conductive bump on the circular pad comprises a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump.
15. The device according to claim 14 , wherein a through via extends from the redistribution layer through the insulating film.
16. The device according to claim 15 , wherein the through via is at least partially filled with conductive material.
17. The device according to claim 14 , wherein the hemispherical conductive bump comprises a solder bump.
18. The device according to claim 17 , wherein the solder bump comprises a eutectic solder.
19. The device according to claim 17 , wherein the solder bump comprises a lead-free solder.
20. The device according to claim 14 , wherein the circular pad is on the insulating film.