Patent Assignment
Reel/Frame 044234/0607
Assignment of Assignor's Interest
Recorded: 2017-11-28
Pages: 9
Assignors
CHIU, CHIN TIEN
Executed: 2017-09-01
TAI, TIGER
Executed: 2017-08-30
QIAN, KEN
Executed: 2017-11-17
LIAO, CC
Executed: 2017-08-24
TAKIAR, HEM
Executed: 2017-08-23
SINGH, GURSHARAN
Executed: 2017-08-30
Assignee
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property
(1)
Semiconductor Package and Method of Fabricating Semiconductor Package
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2024
From: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0523 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →