Patent Assignment
Reel/Frame 066087/0523
Assignment of Assignor's Interest
Recorded: 2024-01-10
Pages: 6
Assignor
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.
Executed: 2023-12-19
Assignee
SANDISK TECHNOLOGIES LLC
5601 GREAT OAKS PKWY, LEGAL DEP., SAN JOSE, CALIFORNIA, 95119
Covered Properties
(16)
Emi Shielding and Thermal Dissipation for Semiconductor Device
Waterfall Wire Bonding
Semiconductor Device Including Electromagnetic Absorption and Shielding
Wire Tail Connector for a Semiconductor Device
Semiconductor Device Including Embedded Controller Die and Method of Making Same
Semiconductor Device Including Alternating Stepped Semiconductor Die Stacks
Semiconductor Device Including Electromagnetic Absorption and Shielding
Semiconductor Device Including Interconnected Package on Package
Fan Out Semiconductor Device Including a Plurality of Semiconductor Die
Vertical Semiconductor Device Having a Stacked Die Block
Semiconductor Device Including Vertically Integrated Groups of Semiconductor Packages
Semiconductor Package and Method of Fabricating Semiconductor Package
Semiconductor Device
Semiconductor Device Including Optically Connected Wafer Stack
Datacenter 3D Solid State Drives with Matrix Cooling
Semiconductor Device Including Control Switches to Reduce Pin Capacitance
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 30, 2013
From: FU, PENG; LUO, SHAN; LU, ZHONG; QIAN, KAIYOU
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 031308/0951 →
Assignment of Assignor's Interest
Jan 14, 2014
From: LU, ZHONG; YU, FEN; CHIU, CHIN TIEN; YU, CHEEMAN
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 031960/0646 →
Assignment of Assignor's Interest
Apr 7, 2014
From: HUANG, DACHENG; BAI, YE; QIAN, KAIYOU; CHIU, CHIN-TIEN
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 032620/0572 →
Assignment of Assignor's Interest
Aug 5, 2014
From: CHIU, CHIN-TIEN; YU, CHEEMAN; TAKIAR, HEM
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 033463/0284 →
Assignment of Assignor's Interest
Oct 9, 2015
From: KUMAR, SHIV; CHIU, CHIN-TIEN; HUANG, DACHENG; LU, ZHONG
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 036765/0053 →
Assignment of Assignor's Interest
Dec 1, 2015
From: KUMAR, SHIV; CHIU, CHIN-TIEN; QIAN, KAIYOU; YU, CHEEMAN
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 037180/0700 →
Assignment of Assignor's Interest
Jan 27, 2017
From: HUANG, DACHENG; BAI, YE; QIAN, KAIYOU; CHIU, CHIN-TIEN
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 041112/0077 →
Assignment of Assignor's Interest
Jun 12, 2017
From: CHIU, CHIN-TIEN; TAKIAR, HEM
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 042675/0601 →
Assignment of Assignor's Interest
Jun 12, 2017
From: ZHANG, CONG; XIAO, FUQIANG; XU, BIN; WU, HAIJUN
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 042676/0562 →
Assignment of Assignor's Interest
Jun 12, 2017
From: UPADHYAYULA, SURESH; YE, NING; CHIU, CHIN TIEN; TAKIAR, HEM
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 042679/0096 →
Assignment of Assignor's Interest
Jun 13, 2017
From: LIU, YANGMING; CHIU, CHIN-TIEN; JI, ZHONGLI; DONG, SHAOPENG
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 042691/0559 →
Assignment of Assignor's Interest
Nov 28, 2017
From: CHIU, CHIN TIEN; TAI, TIGER; QIAN, KEN; LIAO, CC
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 044234/0607 →
Assignment of Assignor's Interest
Dec 5, 2017
From: CHIU, CHIN TIEN; TAKIAR, HEM; SINGH, GURSHARAN; YU, FISHER
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 044299/0060 →
Assignment of Assignor's Interest
Feb 27, 2018
From: CHIU, CHIN-TIEN; BAI, YE; MA, SHINENG; LIU, TING
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 045047/0603 →
Assignment of Assignor's Interest
Feb 27, 2018
From: CHIU, CHIN-TIEN; JI, ZHONGLI; TAKIAR, HEM
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 045055/0278 →
Assignment of Assignor's Interest
Mar 9, 2018
From: MA, SHINENG; CHIU, CHIN-TIEN; LIAO, CHIH-CHIN; BAI, YE
To: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 045157/0601 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Assignment of Assignor's Interest
Apr 8, 2025
From: SANDISK TECHNOLOGIES, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070778/0160 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →