Waterfall wire bonding
View Patent ↗A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.
1. A semiconductor device, comprising:
a first semiconductor die including a first die bonding pad;
a second semiconductor die including a second die bonding pad, the first semiconductor die affixing to the second semiconductor die;
a component including an electrical contact, the second semiconductor die affixing to the component; and
a continuous length of wire, comprising:
a first portion in between the first die bonding pad and the second die bonding pad,
a mutually diffused portion mutually diffused with the second die bonding pad, and
a second portion in between the second die bonding pad and the electrical contact, the mutually diffused portion of the continuous length of wire having a thickness in a direction perpendicular to a surface of the second die bonding pad that is smaller than a diameter of the first portion and the second portion, the continuous length of wire electrically coupling the second die bonding pad of the second semiconductor die with the first die bonding pad of the first semiconductor die and the electrical contact of the component.
2. The semiconductor device of claim 1 , wherein the diameter of the first portion and second portion of the wire is in a range from about 12.7 μm to about 38.1 μm.
3. The semiconductor device of claim 2 , wherein the thickness of the mutually diffused portion of the wire is no less than 5 microns.
4. The semiconductor device of claim 1 , wherein the first portion of the wire has an angle of about 30° to 70° relative to a reference plane parallel to the second die bonding pad and the second portion of the wire has an angle of about 45° to 90° relative to the reference plane.
5. The semiconductor device of claim 4 , wherein projection of the first portion of the wire on the reference plane and projection of the second portion of the wire on the reference plane is not along a straight line.
6. The semiconductor device of claim 4 , wherein the mutually diffused portion of the wire has a substantially circular shape in the reference plane.
7. The semiconductor device of claim 1 , wherein the second die bonding pad comprises gold or aluminum.
8. The semiconductor device of claim 1 , wherein the wire comprises gold wire, copper wire, palladium wire, palladium plated copper wire or silver based alloy wire.
9. The semiconductor device of claim 1 , wherein the component is a substrate and the electrical contact is a contact pad.
10. The semiconductor device of claim 9 , wherein the substrate comprises printed circuit board (PCB), leadframe and Tape Automated Bonding (TAB) tape.
11. The semiconductor device of claim 1 , wherein the component is a third semiconductor die and the electrical contact is a third die bonding pad.