IP Library Assignment 031960/0646
Patent Assignment
Reel/Frame 031960/0646

Assignment of Assignor's Interest

Recorded: 2014-01-14 Pages: 8
Assignors
LU, ZHONG
Executed: 2013-12-23
YU, FEN
Executed: 2013-12-26
CHIU, CHIN TIEN
Executed: 2013-12-26
YU, CHEEMAN
Executed: 2013-12-20
XIAO, FUQIANG
Executed: 2013-12-23
Assignee
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property (1)
Waterfall Wire Bonding
Patent: 9,704,797 →
Application: 14/118,485 →
Publication: US 2014/0183727
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2024
From: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0523 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →