Patent Assignment
Reel/Frame 037180/0700
Assignment of Assignor's Interest
Recorded: 2015-12-01
Pages: 7
Assignors
KUMAR, SHIV
Executed: 2014-12-03
CHIU, CHIN-TIEN
Executed: 2014-12-03
QIAN, KAIYOU
Executed: 2014-12-03
YU, CHEEMAN
Executed: 2014-12-03
Assignee
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
NO. 388, JIANG CHUAN EAST ROAD, MINHANG DISTRICT, SHANGHAI, 200241, CHINA
Covered Property
(1)
Semiconductor Device Including Embedded Controller Die and Method of Making Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2024
From: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO. LTD.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066087/0523 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →