Semiconductor device including electromagnetic absorption and shielding
View Patent ↗A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate ( 202 ), one or more semiconductor die ( 224,225 ), and molding compound around the one or more semiconductor die ( 224,225 ). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer ( 210 ) on the substrate ( 202 ). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
1. A semiconductor device, comprising:
a substrate including a dielectric core, a conductive layer on the dielectric core, and a solder mask layer on the conductive layer, the substrate including a first absorbing material for absorbing at least one of EMI and RFI;
one or more semiconductor die affixed to the substrate;
an encapsulant covering the one or more semiconductor die; and
first and second continuous layers provided on the encapsulant, the first and second continuous layers being directly adjacent to each other, the first continuous layer including a second absorbing material for absorbing at least one of EMI and RFI, and the second continuous layer including a conductive material for shielding the semiconductor device against at least one of EMI and RFI.
2. The semiconductor device of claim 1 , wherein the first absorbing material is provided as part of the solder mask.
3. The semiconductor device of claim 2 , wherein the first absorbing material is mixed in as part of the solder mask.
4. The semiconductor device of claim 2 , wherein the first absorbing material is provided as a layer on the solder mask prior to application of the solder mask to the substrate.
5. The semiconductor device of claim 1 , wherein the first absorbing material is provided as a layer on the solder mask after application of the solder mask to the substrate.
6. The semiconductor device of claim 1 , wherein the first absorbing material is provided as part of the dielectric core.
7. The semiconductor device of claim 1 , wherein at least one of the first and second absorbing materials is ferrite.
8. The semiconductor device of claim 1 , wherein at least one of the first and second absorbing materials is one of silicon carbide, carbon nanotube, magnesium dioxide, carbonyl iron powder, SENDUST, iron silicide, magnetic alloys and magnetic flakes and powders.
9. A semiconductor device, comprising:
a substrate;
a solder mask layer on the substrate, the solder mask layer including a first absorbing material for absorbing at least one of EMI and RFI;
one or more semiconductor die affixed and electrically connected to the substrate;
a molding compound encapsulating at least the one or more semiconductor die; and
first and second continuous layers provided on the molding compound, the first continuous layer including a second absorbing material for absorbing at least one of EMI and RFI, and the second continuous layer including a conductive material for shielding the semiconductor device against at least one of EMI and RFI.
10. The semiconductor device of claim 9 , wherein the first absorbing material is mixed in as part of the solder mask.
11. The semiconductor device of claim 9 , wherein the first absorbing material is provided as a layer on the solder mask prior to application of the solder mask to the substrate.
12. The semiconductor device of claim 9 , further comprising a ground pin connected to a ground plane in the substrate and connected to the second layer.
13. The semiconductor device of claim 9 , wherein the first and second absorbing materials are of the same composition.
14. The semiconductor device of claim 9 , wherein the first layer of the second absorbing materials is provided on a top surface of the molding compound and on sides of the molding compound extending down and into contact with the solder mask layer on the substrate, the first and second absorbing materials completely encasing the one or more semiconductor die.
15. The semiconductor device of claim 9 , wherein the first layer of the second absorbing material is provided on a top surface of the molding compound and not on sides of the molding compound that extend into contact with the solder mask layer.
16. The semiconductor device of claim 9 , wherein the first layer of the second absorbing material is provided on the molding compound, and the second layer of the conductive material is provided on the first layer of absorbing material.
17. The semiconductor device of claim 9 , wherein the second layer of the conductive material is provided on the molding compound, and the first layer of the second absorbing material is provided on the second layer of conducting material.