Wire tail connector for a semiconductor device
View Patent ↗A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
1. A memory device, comprising:
a substrate including a plurality of contact pads;
one or more semiconductor die including a plurality of die bond pads;
a molding compound applied on the substrate and encapsulating the one or more semiconductor die, the molding compound and substrate together forming a flat planar surface upon singulation of the molding compound and substrate together, a contact pad of the plurality of contact pads having a severed edge exposed at the flat planar surface of the molding compound; and
an external connection provided on one or more surfaces of the molding compound for electrically coupling the contact pad with a die bond pad of the plurality of die bond pads.
2. The device of claim 1 , wherein the external connection terminates at a contact pad at the flat planar surface of the molding compound and starts on the same flat planar surface.
3. The device of claim 1 , wherein the external connection terminates at a contact pad on a first surface of the memory device and starts on the flat planar surface of the molding compound different than the first surface.
4. The device of claim 1 , wherein the external connection extends in a straight line from its start to its finish in contact with the contact pad.
5. The device of claim 1 , wherein the external connection includes a first portion extending from its start and a second portion terminating at the contact pad, the first and second portions extending at discontinuous angles with respect to each other.
6. The device of claim 1 , wherein the one or more semiconductor die include at least two stacked semiconductor die.
7. The device of claim 6 , further comprising electrical leads extending from die bond pads on each of the at least two stacked semiconductor die, the electrical leads terminating at a surface of the molding compound, the external connectors electrically connecting the electrical leads to at least one contact pad of the plurality of contact pads.
8. The device of claim 1 , further comprising a wire bond having a first end electrically connected to the die bond pad and a second tail end, opposite the first end, terminating at a surface of the molding compound.
9. A memory device, comprising:
a substrate including a plurality of contact pads;
one or more semiconductor die including a plurality of die bond pads;
a molding compound applied on the substrate and encapsulating the one or more semiconductor die, the molding compound and substrate together forming a flat planar surface upon singulation of the molding compound and substrate together, a contact pad of the plurality of contact pads having a severed edge exposed at the flat planar surface of the molding compound; and
a wire bond having a first end electrically connected to the die bond pad and a second tail end, opposite the first end, terminating at a surface of the molding compound.
10. The device of claim 9 , wherein the external connection terminates at a contact pad at the flat planar surface of the molding compound and starts on the same flat planar surface.
11. The device of claim 9 , wherein the external connection terminates at a contact pad on a first surface of the memory device and starts on the flat planar surface of the molding compound different than the first surface.
12. The device of claim 9 , wherein the external connection extends in a straight line from its start to its finish in contact with the contact pad.
13. The device of claim 9 , wherein the external connection includes a first portion extending from its start and a second portion terminating at the contact pad, the first and second portions extending at discontinuous angles with respect to each other.
14. The device of claim 9 , wherein the one or more semiconductor die include at least two stacked semiconductor die.
15. The device of claim 14 , further comprising electrical leads extending from die bond pads on each of the at least two stacked semiconductor die, the electrical leads terminating at a surface of the molding compound, the external connectors electrically connecting the electrical leads to at least one contact pad of the plurality of contact pads.