IP Library › Assignment 044239/0055
Patent Assignment
Reel/Frame 044239/0055

Assignment of Assignor's Interest

Recorded: 2017-11-28 Pages: 3
Assignor
HOWE, GARY L.
Executed: 2017-11-28
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83707-0006
Covered Property (1)
Systems and Methods for Temperature Sensor Access in Die Stacks
Application: 15/824,559 →
Publication: US 2019/0161341
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →