IP Library › Assignment 044441/0415
Patent Assignment
Reel/Frame 044441/0415

Assignment of Assignor's Interest

Recorded: 2017-12-19 Pages: 4
Assignors
GANDHI, JASPREET S.
Executed: 2015-07-09
ARNOLD, DALE
Executed: 2015-07-13
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Solder Bond Site Including an Opening with Discontinuous Profile
Application: 15/847,687 →
Publication: US 2019/0074194
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →