Patent Assignment
Reel/Frame 044486/0482
Assignment of Assignor's Interest
Recorded: 2017-12-26
Pages: 3
Assignor
CHEW, YI XIN
Executed: 2016-06-23
Assignee
PEP INNOVATION PTE LTD
65 A JALAN TENTERAM, #05-04, SINGAPORE, 328958, SINGAPORE
Covered Property
(1)
Semiconductor Packaging Method, Semiconductor Package and Stacked Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.