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Patent Assignment
Reel/Frame 070617/0478

License

Recorded: 2025-03-05 Pages: 25
Assignor
PEP INNOVATION PTE LTD
Executed: 2024-12-30
Assignee
CR RUNAN TECHNOLOGIES (CHONGQING) CO. LTD.
ROOM 216, BUILDING D, XIYONG AVENUE NO. 25, SHAPINGBA DISTRICT, CHONGQING, CHINA
Covered Property (1)
Semiconductor Packaging Method, Semiconductor Package and Stacked Semiconductor Packages
Application: 15/739,939 →
Publication: US 2018/0190513
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2017
From: CHEW, YI XIN
To: PEP INNOVATION PTE LTD
Reel/Frame 044486/0482 →