Patent Assignment
Reel/Frame 044773/0890
Assignment of Assignor's Interest
Recorded: 2018-01-30
Pages: 11
Assignors
LOMELI, NANCY M.
Executed: 2018-01-30
GEORGE, TOM
Executed: 2018-01-30
GREENLEE, JORDAN D.
Executed: 2018-01-30
POOK, SCOTT M.
Executed: 2018-01-30
MELDRIM, JOHN MARK
Executed: 2018-01-30
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Conductive Structures and Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 7 to Patent Security Agreement
Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
Assignment of Assignor's Interest
Oct 2, 2023
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP LLC
Reel/Frame 065090/0193 →