Patent Assignment
Reel/Frame 065090/0193
Assignment of Assignor's Interest
Recorded: 2023-10-02
Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties
(3)
Conductive Structures and Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures
Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Conductive Structures
Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Conductive Structures
Application:
17/502,501 →
Publication:
US 2022/0037358
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 30, 2018
From: LOMELI, NANCY M.; GEORGE, TOM; GREENLEE, JORDAN D.; POOK, SCOTT M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044773/0890 →
Supplement No. 7 to Patent Security Agreement
Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →