Patent Assignment
Reel/Frame 044777/0233
Assignment of Assignor's Interest
Recorded: 2018-01-30
Pages: 4
Assignor
MICRON TECHNOLOGY TAIWAN, INC.
Executed: 2017-10-16
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, INDIANA, 83707-0006
Covered Property
(1)
Semiconductor Package with Embedded Mim Capacitor, and Method of Fabricating Thereof
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2017
From: SHIH, SHING-YIH; KUAN, SHIH-FAN; WU, TIEH-CHIANG
To: INOTERA MEMORIES, INC.
Reel/Frame 040833/0020 →
Change of Name
Oct 24, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY TAIWAN, INC.
Reel/Frame 044283/0711 →
Supplement No. 7 to Patent Security Agreement
Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →