IP Library Assignment 044882/0864
Patent Assignment
Reel/Frame 044882/0864

Assignment of Assignor's Interest

Recorded: 2017-12-15 Pages: 5
Assignor
UNITY SEMICONDUCTOR
Executed: 2017-01-11
Assignee
KOBUS SAS
611 RUE ARISTIDE BERGES, ZAC DE PRE MILLET, MONTBONNOT-SAINT-MARTIN, 38330, FRANCE
Covered Properties (3)
Chemical Vapor Deposition Device
Patent: 9,777,374 →
Application: 14/769,414 →
Publication: US 2016/0002788
Chemical Vapor Deposition Device
Application: 14/769,687 →
Publication: US 2016/0002776
Gas-Phase Deposition Process
Application: 15/127,218 →
Publication: US 2017/0107615
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 9, 2015
From: NAL, PATRICE; BOREAN, CHRISTOPHE; VITIELLO, JULIEN
To: ALTATECH SEMICONDUCTOR
Reel/Frame 036991/0203 →
Assignment of Assignor's Interest Nov 9, 2015
From: NAL, PATRICE; BOREAN, CHRISTOPHE; VITIELLO, JULIEN
To: ALTATECH SEMICONDUCTOR
Reel/Frame 036991/0186 →
Assignment of Assignor's Interest Nov 10, 2016
From: VITIELLO, JULIEN
To: ALTATECH SEMICONDUCTOR
Reel/Frame 040280/0053 →
Corrective Assignment to Correct the Execution Date Previously Recorded on Reel 040280 Frame 0053. Assignor(S) Hereby Confirms the Assignment. Nov 28, 2016
From: VITIELLO, JULIEN
To: ALTATECH SEMICONDUCTOR
Reel/Frame 040691/0575 →
Change of Name Dec 15, 2017
From: ALTATECH SEMICONDUCTOR
To: UNITY SEMICONDUCTOR
Reel/Frame 044882/0814 →
Security Interest Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
Security Interest Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
Security Interest Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
Release of Security Interest Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC
Reel/Frame 061070/0642 →