IP Library › Assignment 044987/0490
Patent Assignment
Reel/Frame 044987/0490

Assignment of Assignor's Interest

Recorded: 2018-02-21 Pages: 8
Assignors
FAY, OWEN R.
Executed: 2012-09-05
KIRBY, KYLE K.
Executed: 2012-09-10
ENGLAND, LUKE G.
Executed: 2012-09-06
GANDHI, JASPREET S.
Executed: 2012-09-05
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Methods for Forming Interconnect Assemblies with Probed Bond Pads
Application: 15/478,133 →
Publication: US 2017/0207139
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 4 to Patent Security Agreement May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →