IP Library › Assignment 045088/0314
Patent Assignment
Reel/Frame 045088/0314

Assignment of Assignor's Interest

Recorded: 2018-03-02 Pages: 4
Assignors
GANDHI, JASPREET S.
Executed: 2015-03-30
HUANG, WAYNE H.
Executed: 2015-03-30
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Semiconductor Device Having Through-Silicon-via and Methods of Forming the Same
Application: 15/910,136 →
Publication: US 2018/0190571
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 8 to Patent Security Agreement May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →