Patent Assignment
Reel/Frame 045092/0159
Assignment of Assignor's Interest
Recorded: 2018-03-02
Pages: 15
Assignors
JOHNSON, CHRIS
Executed: 2013-01-23
JOHNSON, DAVID
Executed: 2013-01-08
MARTINEZ, LINNELL
Executed: 2013-01-18
PAYS-VOLARD, DAVID
Executed: 2013-01-30
WESTERMAN, RUSSELL
Executed: 2013-01-14
GRIVNA, GORDON M.
Executed: 2014-04-03
ON SEMICONDUCTOR CORPORATION
Executed: 2014-04-03
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC
Executed: 2014-04-03
ON SEMICONDUCTOR TRADING, SARL
Executed: 2014-04-03
Assignee
PLASMA-THERM, LLC
10050 16TH STREET NORTH, ST. PETERSBURG, FLORIDA, 33716
Covered Property
(1)
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058899/0658 →
Security Interest
Nov 23, 2021
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; PLASMA-THERM NES, LLC
To: HSBC BANK USA, N.A.
Reel/Frame 058945/0169 →
Security Interest
Jun 28, 2022
From: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; REV-TECH MANUFACTURING SOLUTIONS, LLC; HINE AUTOMATION, LLC
To: VALLEY NATIONAL BANK
Reel/Frame 060447/0766 →
Release of Security Interest
Aug 3, 2022
From: HSBC BANK USA, N.A.
To: RAJE TECHNOLOGY GROUP, LLC; PLASMA-THERM, LLC; PLASMA-THERM IC-DISC, INC.; PLASMA-THERM NES, LLC
Reel/Frame 061070/0642 →