IP Library › Assignment 045187/0033
Patent Assignment
Reel/Frame 045187/0033

Assignment of Assignor's Interest

Recorded: 2018-03-13 Pages: 4
Assignors
PALAGUD, JOSE FELIXMINIA
Executed: 2018-03-13
WANG, SOON WEI
Executed: 2018-03-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Multi-Chip Packages with Stabilized Die Pads
Application: 15/919,516 →
Publication: US 2019/0287884
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 6, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047734/0068 →
Release of Security Interest in Patents Recorded at Reel 047734, Frame 0068 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064160/0027 →