Patent Assignment
Reel/Frame 045252/0851
Assignment of Assignor's Interest
Recorded: 2018-03-16
Pages: 11
Assignors
MAJUMDAR, AMITAVA
Executed: 2018-02-28
KAMANA, RAJESH
Executed: 2018-02-28
WANG, HONGMEI
Executed: 2018-02-28
LYONSMITH, SHAWN D.
Executed: 2018-03-01
HILL, ERVIN T.
Executed: 2018-03-08
LIU, ZENGTAO T.
Executed: 2018-02-28
HUG, MARLON W.
Executed: 2018-02-28
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Non-Contact Electron Beam Probing Techniques and Related Structures
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →