Patent Assignment
Reel/Frame 045322/0759
Assignment of Assignor's Interest
Recorded: 2018-03-23
Pages: 4
Assignors
MIYASHIRO, HIROSHI
Executed: 2018-03-19
SURUGA, YOICHI
Executed: 2018-03-19
KOYANO, SHUHEI
Executed: 2018-03-19
Assignee
NIPPON MEKTRON, LTD.
12-15, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8585, JAPAN
Covered Property
(1)
Ultrasonic Bonding Jig, Ultrasonic Bonding Method, and Bonding Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.