Patent Assignment
Reel/Frame 045768/0850
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 8
Assignors
KWEON, YOUNG DO
Executed: 2018-04-16
CHAE, JEONGBYUNG
Executed: 2018-04-13
PARK, DONGJOO
Executed: 2018-04-13
CHO, BYOUNGWOO
Executed: 2018-04-13
HONG, SEHWAN
Executed: 2018-04-13
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Package Using Cavity Substrate and Manufacturing Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.