Patent Assignment
Reel/Frame 045838/0903
Assignment of Assignor's Interest
Recorded: 2018-05-17
Pages: 3
Assignor
SANDHU, GURTEJ S.
Executed: 2018-05-17
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming a Semiconductor Structure and Methods of Forming Isolation Structures
Patent:
10,381,218 →
Application:
15/982,872 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →