Patent Assignment
Reel/Frame 046031/0365
Assignment of Assignor's Interest
Recorded: 2018-06-08
Pages: 6
Assignors
MAUER, LAURA
Executed: 2015-11-10
TADDEI, JOHN
Executed: 2015-11-10
CLARK, JOHN
Executed: 2015-11-10
LAWRENCE, ELENA
Executed: 2015-11-10
ZWIRNMANN, ERIC KURT
Executed: 2015-11-10
GOLDBERG, DAVID A.
Executed: 2015-11-10
YUTKOWITZ, JONATHAN
Executed: 2015-11-10
Assignee
VEECO PRECISION SURFACE PROCESSING LLC
185 GIBRALTAR ROAD, HORSHAM, PENNSYLVANIA, 19044
Covered Property
(1)
Two Etch Method for Achieving a Wafer Thickness Profile
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2019
From: VEECO PRECISION SURFACE PROCESSING LLC
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0549 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →