Patent Assignment
Reel/Frame 046216/0161
Assignment of Assignor's Interest
Recorded: 2018-05-22
Pages: 28
Assignors
LIU, TZU-HAO
Executed: 2018-05-17
CHEN, YI-WEI
Executed: 2018-05-17
CHENG, TSUN-MIN
Executed: 2018-05-17
CHANG, KAI-JIUN
Executed: 2018-05-17
WU, CHIA-CHEN
Executed: 2018-05-17
HUANG, YI-AN
Executed: 2018-05-17
WU, PO-CHIH
Executed: 2018-05-17
CHEN, PIN-HONG
Executed: 2018-05-17
CHIU, CHUN-CHIEH
Executed: 2018-05-17
CHEN, TZU-CHIEH
Executed: 2018-05-17
LIU, CHIH-CHIEN
Executed: 2018-05-17
TSAI, CHIH-CHIEH
Executed: 2018-05-17
LIN, JI-MIN
Executed: 2018-05-17
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same