IP Library › Assignment 046283/0553
Patent Assignment
Reel/Frame 046283/0553

Assignment of Assignor's Interest

Recorded: 2018-07-06 Pages: 5
Assignor
PAREKH, KUNAL R.
Executed: 2018-07-05
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1-525, BOISE, IDAHO, 83716
Covered Property (1)
Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region
Application: 16/029,144 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →
Assignment of Assignor's Interest Apr 17, 2024
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP LLC
Reel/Frame 067135/0353 →