Patent Assignment
Reel/Frame 067135/0353
Assignment of Assignor's Interest
Recorded: 2024-04-17
Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties
(4)
Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region
Patent:
10,446,577 →
Application:
16/029,144 →
Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 6, 2018
From: PAREKH, KUNAL R.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046283/0553 →
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →