IP Library › Assignment 046525/0205
Patent Assignment
Reel/Frame 046525/0205

Assignment of Assignor's Interest

Recorded: 2018-08-01 Pages: 6
Assignors
HOU, SHANG-YUN
Executed: 2018-06-21
HUI, HUANG SUNG
Executed: 2018-06-20
HUANG, KUAN-YU
Executed: 2018-06-21
HU, HSIEN-PIN
Executed: 2018-06-21
WU, CHI-HSI
Executed: 2018-07-02
YU, CHEN-HUA
Executed: 2018-07-02
SHIH, YING-CHING
Executed: 2018-06-22
KAO, CHIN-FU
Executed: 2018-06-20
KUO, LI-CHUNG
Executed: 2018-06-22
LIN, YUSHUN
Executed: 2018-06-21
HUANG, HEH-CHANG
Executed: 2018-06-21
HSIA, HSING-KUO
Executed: 2018-06-20
HUNG, CHIH-CHIEH
Executed: 2018-06-21
WEI, WEN-HSIN
Executed: 2018-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
A Method of Forming a Dummy Die of an Integrated Circuit Having an Embedded Annular Structure
Application: 16/051,848 →
Publication: US 2019/0237454
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Second Inventor's Name Previously Recorded on Reel 046525 Frame 0205. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. May 25, 2021
From: HOU, SHANG-YUN; HUANG, SUNG-HUI; HUANG, KUAN-YU; HU, HSIEN-PIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 056392/0141 →