Patent Assignment
Reel/Frame 056392/0141
Corrective Assignment to Correct the Second Inventor's Name Previously Recorded on Reel 046525 Frame 0205. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Recorded: 2021-05-25
Pages: 8
Assignors
HOU, SHANG-YUN
Executed: 2018-06-21
HUANG, SUNG-HUI
Executed: 2018-06-20
HUANG, KUAN-YU
Executed: 2018-06-21
HU, HSIEN-PIN
Executed: 2018-06-21
WU, CHI-HSI
Executed: 2018-07-02
YU, CHEN-HUA
Executed: 2018-07-02
SHIH, YING-CHING
Executed: 2018-06-22
KAO, CHIN-FU
Executed: 2018-06-20
WEI, WEN-HSIN
Executed: 2018-06-20
KUO, LI-CHUNG
Executed: 2018-06-22
LIN, YUSHUN
Executed: 2018-06-21
HUANG, HEH-CHANG
Executed: 2018-06-21
HSIA, HSING-KUO
Executed: 2018-06-20
HUNG, CHIH-CHIEH
Executed: 2018-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
A Method of Forming a Dummy Die of an Integrated Circuit Having an Embedded Annular Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.