IP Library › Assignment 046550/0155
Patent Assignment
Reel/Frame 046550/0155

Assignment of Assignor's Interest

Recorded: 2018-08-03 Pages: 3
Assignors
HILL, MICHAEL J.
Executed: 2018-07-18
WOJEWODA, LEIGH E.
Executed: 2018-07-12
MANUSHAROW, MATHEW
Executed: 2018-07-11
KULASEKARAN, SIDDARTH
Executed: 2018-07-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Package Structure Having Substrate Thermal Vent Structures for Inductor Cooling
Application: 16/025,710 →
Publication: US 2020/0006287
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Previously Recorded at Reel: 046550 Frame: 0155. Assignor(S) Hereby Confirms the Asssignment. Aug 30, 2018
From: HILL, MICHAEL J.; WOJEWODA, LEIGH E.; MANUSHAROW, MATHEW; KULASEKARAN, SIDDHARTH
To: INTEL CORPORATION
Reel/Frame 046988/0843 →