IP Library › Assignment 046988/0843
Patent Assignment
Reel/Frame 046988/0843

Corrective Assignment to Correct the Conveying Party Previously Recorded at Reel: 046550 Frame: 0155. Assignor(S) Hereby Confirms the Asssignment.

Recorded: 2018-08-30 Pages: 6
Assignors
HILL, MICHAEL J.
Executed: 2018-07-18
WOJEWODA, LEIGH E.
Executed: 2018-07-12
MANUSHAROW, MATHEW
Executed: 2018-07-11
KULASEKARAN, SIDDHARTH
Executed: 2018-08-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Package Structure Having Substrate Thermal Vent Structures for Inductor Cooling
Application: 16/025,710 →
Publication: US 2020/0006287
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 3, 2018
From: HILL, MICHAEL J.; WOJEWODA, LEIGH E.; MANUSHAROW, MATHEW; KULASEKARAN, SIDDARTH
To: INTEL CORPORATION
Reel/Frame 046550/0155 →