Patent Assignment
Reel/Frame 046849/0261
Assignment of Assignor's Interest
Recorded: 2018-09-12
Pages: 4
Assignors
LIANG, KUO-SHENG
Executed: 2018-09-07
PAN, MEI-JU
Executed: 2018-09-07
HSU, MAO-FENG
Executed: 2018-09-07
HUANG, YU-CHENG
Executed: 2018-09-07
Assignee
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property
(1)
Resin Compositon, Removable Adhesive Layer, Ic Substrate, and Ic Packaging Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 18, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064929/0611 →
Assignment of Assignor's Interest
Sep 21, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064990/0603 →