Patent Assignment
Reel/Frame 064990/0603
Assignment of Assignor's Interest
Recorded: 2023-09-21
Pages: 3
Assignor
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Executed: 2023-08-01
Assignee
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property
(1)
Resin Compositon, Removable Adhesive Layer, Ic Substrate, and Ic Packaging Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 12, 2018
From: LIANG, KUO-SHENG; PAN, MEI-JU; HSU, MAO-FENG; HUANG, YU-CHENG
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 046849/0261 →
Change of Name
Sep 18, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064929/0611 →