Patent Assignment
Reel/Frame 064929/0611
Change of Name
Recorded: 2023-09-18
Pages: 3
Assignor
QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Executed: 2023-08-01
Assignee
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
NO.18-2 TENGFEI ROAD,ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE, QINHUANGDAO, CHINA
Covered Property
(1)
Resin Compositon, Removable Adhesive Layer, Ic Substrate, and Ic Packaging Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 12, 2018
From: LIANG, KUO-SHENG; PAN, MEI-JU; HSU, MAO-FENG; HUANG, YU-CHENG
To: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 046849/0261 →
Assignment of Assignor's Interest
Sep 21, 2023
From: QI DING TECHNOLOGY QINHUANGDAO CO., LTD.
To: LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.
Reel/Frame 064990/0603 →