IP Library › Assignment 047382/0708
Patent Assignment
Reel/Frame 047382/0708

Assignment of Assignor's Interest

Recorded: 2018-11-01 Pages: 3
Assignor
GANDHI, JASPREET S.
Executed: 2014-10-08
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Interconnect Structures with Intermetallic Palladium Joints and Associated Systems and Methods
Application: 15/905,086 →
Publication: US 2018/0190620
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 8 to Patent Security Agreement May 7, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 046084/0955 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050709/0965 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →