IP Library Assignment 047523/0324
Patent Assignment
Reel/Frame 047523/0324

Assignment of Assignor's Interest

Recorded: 2018-11-16 Pages: 8
Assignors
CHEN, CHEN
Executed: 2015-04-14
FENG, SHAOGUANG
Executed: 2015-04-21
DUAN, LINGLI
Executed: 2015-04-15
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
New Metal Plating Compositions
Application: 16/112,847 →
Publication: US 2019/0100499
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 7, 2019
From: NIAZIMBETOVA, ZUHRA I.; RZEZNIK, MARIA ANNA
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 047922/0074 →
Assignment of Assignor's Interest Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
Assignment of Assignor's Interest Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
Change of Legal Entity Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →