Patent Assignment
Reel/Frame 047711/0115
Assignment of Assignor's Interest
Recorded: 2018-12-07
Pages: 5
Assignors
AMANAPU, HARI P.
Executed: 2018-01-02
PEETHALA, CORNELIUS BROWN
Executed: 2018-01-02
PATLOLLA, RAGHUVEER R.
Executed: 2018-01-02
YANG, CHIH-CHAO
Executed: 2018-01-02
NOGAMI, TAKESHI
Executed: 2018-01-01
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Application:
16/213,618 →
Publication:
US 2019/0221477
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0324 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Corrective Assignment to Correct the 16/161,111 Previously Recorded on Reel 051489 Frame 0324. Assignor(S) Hereby Confirms the Assignment.
Aug 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053389/0252 →
Certificate of Conversion & Change of Name
Apr 15, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059723/0098 →
Change of Name
Aug 14, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064586/0940 →