Patent Assignment
Reel/Frame 059723/0098
Certificate of Conversion & Change of Name
Recorded: 2022-04-15
Pages: 5
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Application:
16/213,618 →
Publication:
US 2019/0221477
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 7, 2018
From: AMANAPU, HARI P.; PEETHALA, CORNELIUS BROWN; PATLOLLA, RAGHUVEER R.; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 047711/0115 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0324 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Corrective Assignment to Correct the 16/161,111 Previously Recorded on Reel 051489 Frame 0324. Assignor(S) Hereby Confirms the Assignment.
Aug 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053389/0252 →
Change of Name
Aug 14, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064586/0940 →