Patent Assignment
Reel/Frame 064586/0940
Change of Name
Recorded: 2023-08-14
Pages: 4
Assignor
TESSERA LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR SOLUTIONS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Patent:
10,204,829 →
Application:
15/870,213 →
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Application:
16/213,618 →
Publication:
US 2019/0221477
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 15, 2018
From: AMANAPU, HARI P.; PEETHALA, CORNELIUS BROWN; PATLOLLA, RAGHUVEER R.; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044622/0422 →
Assignment of Assignor's Interest
Dec 7, 2018
From: AMANAPU, HARI P.; PEETHALA, CORNELIUS BROWN; PATLOLLA, RAGHUVEER R.; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 047711/0115 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0324 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Corrective Assignment to Correct the 16/161,111 Previously Recorded on Reel 051489 Frame 0324. Assignor(S) Hereby Confirms the Assignment.
Aug 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053389/0252 →
Certificate of Conversion & Change of Name
Apr 15, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059723/0098 →
Change of Name
Apr 29, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059835/0051 →