Patent Assignment
Reel/Frame 044622/0422
Assignment of Assignor's Interest
Recorded: 2018-01-15
Pages: 5
Assignors
AMANAPU, HARI P.
Executed: 2018-01-02
PEETHALA, CORNELIUS BROWN
Executed: 2018-01-02
PATLOLLA, RAGHUVEER R.
Executed: 2018-01-02
YANG, CHIH-CHAO
Executed: 2018-01-02
NOGAMI, TAKESHI
Executed: 2018-01-01
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Patent:
10,204,829 →
Application:
15/870,213 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Apr 29, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059835/0051 →
Change of Name
Aug 14, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064586/0940 →