IP Library › Assignment 048375/0934
Patent Assignment
Reel/Frame 048375/0934

Assignment of Assignor's Interest

Recorded: 2019-02-19 Pages: 4
Assignors
HO, CHENG-LIN
Executed: 2019-02-12
LEE, CHIH-CHENG
Executed: 2019-02-12
CHEN, CHUN CHEN
Executed: 2019-02-12
CHEN, CHEN YUANG
Executed: 2019-02-12
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property (1)
Semiconductor Device Package, Electronic Assembly and Method for Manufacturing the Same
Application: 16/264,602 →
Publication: US 2020/0118912
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the First and Middle Name of the Fourth Inventor Previously Recorded on Reel 048375 Frame 0934. Assignor(S) Hereby Confirms the Assignment. Feb 10, 2022
From: HO, CHENG-LIN; LEE, CHIH-CHENG; CHEN, CHUN CHEN; CHEN, CHENG YUAN
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 059008/0909 →