IP Library › Assignment 059008/0909
Patent Assignment
Reel/Frame 059008/0909

Corrective Assignment to Correct the First and Middle Name of the Fourth Inventor Previously Recorded on Reel 048375 Frame 0934. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2022-02-10 Pages: 6
Assignors
HO, CHENG-LIN
Executed: 2019-02-12
LEE, CHIH-CHENG
Executed: 2019-02-12
CHEN, CHUN CHEN
Executed: 2019-02-12
CHEN, CHENG YUAN
Executed: 2021-05-27
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property (1)
Semiconductor Device Package, Electronic Assembly and Method for Manufacturing the Same
Application: 16/264,602 →
Publication: US 2020/0118912
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 19, 2019
From: HO, CHENG-LIN; LEE, CHIH-CHENG; CHEN, CHUN CHEN; CHEN, CHEN YUANG
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 048375/0934 →