Semiconductor device package, electronic assembly and method for manufacturing the same
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
1. An electronic assembly, comprising:
a board structure, comprising:
a substrate; and
a patterned conductive layer disposed on a surface of the substrate; and
a semiconductor device package attached to the board structure, the semiconductor device package comprising:
a carrier;
an electronic component disposed on a surface of the carrier;
a connection element disposed on the surface and adjacent to an edge of the carrier; and
an encapsulant disposed on the surface of the carrier and encapsulating the electronic component,
wherein the semiconductor device package is attached to the board structure with the edge of the carrier and an edge of the encapsulant facing the surface of the substrate; and
wherein the board structure further comprises a protection layer disposed on the surface of the substrate and partially covering the patterned conductive layer, and the protection layer includes at least one opening partially exposing the patterned conductive layer.
2. The electronic assembly of claim 1 , wherein a gap is formed between the encapsulant and the connection element.
3. The electronic assembly of claim 1 , further comprising at least one solder structure disposed in the at least one opening of the protection layer to bond and electrically connect the connection element to the patterned conductive layer.
4. The electronic assembly of claim 3 , wherein the solder structure further covers an upper surface of the connection element and an upper surface of the protection layer.
5. The electronic assembly of claim 4 , wherein the solder structure further partially covers an upper surface of the encapsulant.
6. The electronic assembly of claim 1 , wherein the semiconductor device package and the substrate form an L-shaped structure.
7. The electronic assembly of claim 1 , wherein the edge of the carrier is supported by the protection layer.
8. The electronic assembly of claim 1 , wherein the electronic assembly comprises a plurality of the semiconductor device packages, and the connection elements are separated from each other by the encapsulants.
9. The electronic assembly of claim 1 , wherein the encapsulant includes a thicker portion encapsulating the electronic component and adjacent to a first side of the connection element, and a thinner portion between a second side of the connection element and the edge of the carrier.
10. The electronic assembly of claim 1 , wherein the connection element comprises a first connection structure adjacent to the surface of the carrier, and a second connection structure disposed on the first connection structure.
11. The electronic assembly of claim 10 , wherein the first connection structure and the second connection structure each have a curve profile.
12. The electronic assembly of claim 11 , wherein the first connection structure and the second connection structure each have a maximum width measured along a direction parallel to the surface of the carrier, and the maximum width of the second connection structure is larger than the maximum width of the first connection structure.
13. The electronic assembly of claim 10 , wherein the first connection structure and the second connection structure each have an imaginary central line normal to the surface of the carrier, and the imaginary central line of the second connection structure is offset from the imaginary central line of the first connection structure toward the edge of the encapsulant.
14. The electronic assembly of claim 10 , further comprising a third connection structure disposed between the first connection structure and the second connection structure, wherein the third connection structure has a substantially straight and inclined profile.
15. The electronic assembly of claim 10 , wherein the first connection structure is extending along a direction normal to the surface of the carrier, and the second connection structure is connected to the first connection structure and extending along a direction parallel to the surface of the carrier.
16. The electronic assembly of claim 15 , wherein the second connection structure is substantially coplanar with the upper surface and the edge of the encapsulant.