Patent Assignment
Reel/Frame 048564/0339
Assignment of Assignor's Interest
Recorded: 2019-03-11
Pages: 3
Assignee
KUN YUAN TECHNNOLOGY CO., LTD.
NO. 118, CHUNG-HUA RD., CHU-NAN, MIAO-LI, 35053, TAIWAN
Covered Property
(1)
Chip Packaging Method and Structure Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.