IP Library › Assignment 048567/0463
Patent Assignment
Reel/Frame 048567/0463

Merger

Recorded: 2019-03-11 Pages: 8
Assignor
DAWNING LEADING TECHNOLOGY INC.
Executed: 2018-11-01
Assignee
KING YUAN ELECTRONICS CO., LTD.
NO.81, SEC. 2, GONGDAO 5TH RD., PUDING VIL., EAST DIST., HSINCHU CITY, 30070, TAIWAN
Covered Properties (10)
Package Module for a Memory Ic Chip
Patent: 8,014,163 →
Application: 12/385,637 →
Publication: US 2010/0149758
Chip Packaging Method and Structure Thereof
Patent: 8,420,523 →
Application: 13/307,647 →
Publication: US 2012/0070943
Method for Manufacturing a Chip Packaging Structure
Patent: 8,962,390 →
Application: 13/327,491 →
Publication: US 2013/0065363
Micro Electronic Component Structure
Patent: 9,161,446 →
Application: 14/160,452 →
Publication: US 2014/0202754
Lead Frame Structure for Quad Flat No-Lead Package, Quad Flat No-Lead Package and Method for Forming the Lead Frame Structure
Patent: 9,607,933 →
Application: 14/176,022 →
Publication: US 2015/0228561
Semiconductor Packaging Structure and Manufacturing Method for the Same
Patent: 9,892,988 →
Application: 14/277,256 →
Publication: US 2015/0228596
Packaging Structure for Thin Die and Method for Manufacturing the Same
Patent: 9,646,937 →
Application: 14/457,356 →
Publication: US 2015/0357288
Semiconductor Packaging Structure Having Stacked Seed Layers
Patent: 9,478,512 →
Application: 14/619,404 →
Publication: US 2016/0233182
Multichip Stacking Package Structure and Method for Manufacturing the Same
Patent: 9,412,722 →
Application: 14/620,705 →
Publication: US 2016/0240512
Metal Top Stacking Package Structure and Method for Manufacturing the Same
Patent: 9,887,145 →
Application: 14/678,278 →
Publication: US 2016/0293509
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2009
From: HSU, CHENG-HO; LIU, KUEI-HUA
To: KUN YUAN TECHNOLOGY CO., LTD.
Reel/Frame 022591/0077 →
Assignment of Assignor's Interest Dec 15, 2011
From: LIN, DIANN-FANG
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 027391/0174 →
Assignment of Assignor's Interest Jan 21, 2014
From: LIN, DIANN FANG
To: DAWNING LEADING TECHNOLOGY INC
Reel/Frame 032013/0339 →
Assignment of Assignor's Interest Feb 7, 2014
From: LIN, DIANN FANG
To: DAWNING LEADING TECHNOLOGY INC
Reel/Frame 032177/0453 →
Assignment of Assignor's Interest May 14, 2014
From: HU, YU-SHAN; LIN, DIANN-FANG
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 032886/0336 →
Assignment of Assignor's Interest Aug 12, 2014
From: LIN, DIANN-FANG
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 033513/0854 →
Assignment of Assignor's Interest Feb 11, 2015
From: HU, YU-SHAN
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 034937/0707 →
Assignment of Assignor's Interest Feb 12, 2015
From: LIN, DIANN-FANG
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 034950/0344 →
Assignment of Assignor's Interest Apr 3, 2015
From: LIN, DIANN-FANG
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 035329/0987 →
Assignment of Assignor's Interest Mar 11, 2019
From: HSU, CHENG-HO; WAN, KUEI PIN
To: KUN YUAN TECHNNOLOGY CO., LTD.
Reel/Frame 048564/0339 →
Change of Name Mar 11, 2019
From: KUN YUAN TECHNOLOGY CO., LTD.
To: DAWNING LEADING TECHNOLOGY INC.
Reel/Frame 048567/0438 →