IP Library › Assignment 048567/0438
Patent Assignment
Reel/Frame 048567/0438

Change of Name

Recorded: 2019-03-11 Pages: 9
Assignor
KUN YUAN TECHNOLOGY CO., LTD.
Executed: 2011-10-20
Assignee
DAWNING LEADING TECHNOLOGY INC.
NO.118, ZHONGHUA RD., DING-PU VIL., ZHUNAN TOWNSHIP, MIAOLI COUNTY, 350, TAIWAN
Covered Properties (2)
Package Module for a Memory Ic Chip
Patent: 8,014,163 →
Application: 12/385,637 →
Publication: US 2010/0149758
Chip Packaging Method and Structure Thereof
Patent: 8,420,523 →
Application: 13/307,647 →
Publication: US 2012/0070943
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 15, 2009
From: HSU, CHENG-HO; LIU, KUEI-HUA
To: KUN YUAN TECHNOLOGY CO., LTD.
Reel/Frame 022591/0077 →
Assignment of Assignor's Interest Mar 11, 2019
From: HSU, CHENG-HO; WAN, KUEI PIN
To: KUN YUAN TECHNNOLOGY CO., LTD.
Reel/Frame 048564/0339 →
Merger Mar 11, 2019
From: DAWNING LEADING TECHNOLOGY INC.
To: KING YUAN ELECTRONICS CO., LTD.
Reel/Frame 048567/0463 →