Patent Assignment
Reel/Frame 048608/0191
Assignment of Assignor's Interest
Recorded: 2019-03-15
Pages: 4
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Chip Stacked and Molded
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.